The Xilinx FPGA #XC4VFX12-10FFG668C combines Advanced Silicon Modular Block (ASMBL™) architecture with a wide variety of flexible features, the Virtex®-4family from Xilinx greatly enhances programmable logic design capabilities, making it a powerful alternative to ASICtechnology. Virtex-4 FPGAs comprise three platform families—LX, FX, and SX—offering multiple feature choices andcombinations to address all complex applications. The wide array of Virtex-4 FPGA hard-IP core blocks includes thePowerPC® processors (with a new APU interface), tri-mode Ethernet MACs, 622 Mb/s to 6.5 Gb/s serial transceivers,dedicated DSP slices, high-speed clock management circuitry, and source-synchronous interface blocks. The basic Virtex-4FPGA building blocks are enhancements of those found in the popular Virtex, Virtex-E, Virtex-II, Virtex-II Pro, andVirtex-II Pro X product families, so previous-generation designs are upward compatible. Virtex-4 devices are produced on astate-of-the-art 90 nm copper process using 300 mm (12-inch) wafer technology.Features• Three Families — LX/SX/FX– Virtex-4 LX: High-performance logic applications solution– Virtex-4 SX: High-performance solution for digital signalprocessing (DSP) applications– Virtex-4 FX: High-performance, full-featured solution forembedded platform applications• Xesium™ Clock Technology– Digital clock manager (DCM) blocks– Additional phase-matched clock dividers (PMCD)– Differential global clocks• XtremeDSP™ Slice– 18 x 18, two’s complement, signed Multiplier– Optional pipeline stages– Built-in Accumulator (48-bit) and Adder/Subtracter• Smart RAM Memory Hierarchy– Distributed RAM– Dual-port 18-Kbit RAM blocks· Optional pipeline stages· Optional programmable FIFO logic automaticallyremaps RAM signals as FIFO signals– High-speed memory interface supports DDR and DDR-2SDRAM, QDR-II, and RLDRAM-II.• SelectIO™ Technology– 1.5V to 3.3V I/O operation– Built-in ChipSync™ source-synchronous technology– Digitally controlled impedance (DCI) active termination– Fine grained I/O banking (configuration in one bank)• Flexible Logic Resources• Secure Chip AES Bitstream Encryption• 90 nm Copper CMOS Process• 1.2V Core Voltage• Flip-Chip Packaging including Pb-Free PackageChoices• RocketIO™ 622 Mb/s to 6.5 Gb/s Multi-GigabitTransceiver (MGT) [FX only]• IBM PowerPC RISC Processor Core [FX only]– PowerPC 405 (PPC405) Core– Auxiliary Processor Unit Interface (User Coprocessor)• Multiple Tri-Mode Ethernet MACs [FX only]